特性
可編程系統(tǒng)集成
高達(dá)1.2m的系統(tǒng)邏輯單元
用于片上存儲器集成的UltraRAM集成100G以太網(wǎng)MAC以支持RS-FEC和150G因特拉肯內(nèi)核
提高系統(tǒng)性能
o.3 teramac dsp計(jì)算性能
與kintex-7fpga相比，系統(tǒng)級性能功率比提高了兩倍以上。
o 16G和28G背板-支持各種收發(fā)器
o中速級支持2666MB/s DDR4
降低物料清單成本
o 12.5gb/s最低速度等極收發(fā)器
集成vcxo和fpll可以降低時鐘組件的成本。
降低總功耗
o.與7系列FPGAs相比，功耗降低了60%
o.電壓縮放選項(xiàng)支持高性能和低功耗
o.使用緊湊的邏輯單元封裝以降低動態(tài)功耗
提高設(shè)計(jì)生產(chǎn)力
o使用vivado設(shè)計(jì)套件進(jìn)行協(xié)作優(yōu)化，以加速設(shè)計(jì)收斂
智能連接技術(shù)在智能ip集成中的應(yīng)用
112mhz點(diǎn)對點(diǎn)mwr調(diào)制解調(diào)器及數(shù)據(jù)包處理
_ 1GHz寬帶調(diào)制解調(diào)器和數(shù)據(jù)包處理
1. Kintex UltraScale + product advantages such as: XCKU9P-L1FFVE900I
K Xilinx Kintex < UltraScale+} Field Programmable Array (FPA) has a variety of power options, which can achieve the best balance between the required system performance and very low power consumption. The FPGA is a semiconductor device based on a configurable logic block (CLB) matrix connected through a programmable interconnection system. Kintex UltraScale + devices are ideal for data packet processing and DSP-intensive functions, and are suitable for applications ranging from wireless MIMO technology to Nx100G network and data center.
Characteristic
Programmable System Integration
Up to 1.2M System Logic Unit
UltraRAM for on-chip memory integrationO Integrating 100G Ethernet MAC to support RS-FEC and 150G Interlaken Kernel
Improving system performance
O.3 TeraMAC DSP Computing Performance
O. Compared with Kintex-7 FPGA, the system-level performance-power ratio has been improved by more than two times.
O 16G and 28G backboards - support various transceivers
O Medium Speed Class Supports 2666Mb/s DDR4
Reducing BOM costs
O 12.5Gb/s transceiver with the lowest speed equal pole
O. The integration of VCXO and fPLL can reduce the cost of clock components
Reduced total power consumption
O. Power consumption is reduced by 60% compared with 7 series of FPGAs
O. Voltage scaling options support high performance and low power consumption
O. Using compact logic unit encapsulation to reduce dynamic power consumption
Increased design productivity
O Collaborative optimization with Vivado Design Suite to accelerate design convergence
Application of Smart Connect Technology for Intelligent IP Integration
112 MHz Point-to-Point MWR Modem and Data Packet Processing
_1GHz eBand Modem and Data Packet Processing
XQVR600-4CB228V
XCZU2CG-1SFVC784E
XCZU2EG-L1SFVA625I
XCKU3P-2FFVB676E
XCZU15EG-2FFVB1156E
XCKU025-1FFVA1156C
XCKU025-1FFVA1156I
XCKU025-2FFVA1156E
XCKU025-2FFVA1156I
XCKU035-1FBVA676I
XCKU035-1FBVA900I
XCKU035-1FFVA1156C
XCKU035-1FFVA1156E
XCKU035-1FFVA1156I
XCKU035-2FBVA676E
XCKU035-2FBVA900I
XCKU035-2FFVA1156C
XCKU035-2FFVA1156E
XCKU035-2FFVA1156I
XCKU040-1FBVA676I
XCKU040-1FBVA900I
XCKU040-1FFVA1156E
XCKU040-2FBVA676E
XCKU040-2FBVA676I
XCKU040-2FBVA900E
XCKU040-2FFVA1156E
XCKU040-2SFVA784E
XCKU040-L1FBVA900I
XCKU040-L1FFVA1156I
XCKU060-2FFVA1156E
XCKU060-2FFVA1517C
XCKU060-2FFVA1517E
XCKU060-2FFVA1517I
XCKU085-1FLVA1517C
XCKU085-1FLVA1517I
XCKU085-2FLVA1517C
XCKU085-2FLVA1517E
XCKU085-2FLVA1517I
XCKU115-1FLVA1517C
XCKU115-1FLVA1517I
XCKU115-1FLVD1924C
XCKU115-1FLVD1924I
XCKU115-1FLVF1924I
XCKU115-2FLVA1517C
XCKU115-2FLVA1517E
XCKU115-2FLVA1517I
XCKU115-2FLVB2104I
XCKU115-2FLVD1924E
XCKU115-2FLVF1924C
XCKU115-2FLVF1924E
XCKU115-2FLVF1924I
XCKU115-3FLVF1924E
XCKU115-L1FLVA2104I
XCKU115-L1FLVB1760I
XCKU115-L1FLVB2104I
XCKU115-L1FLVD1924I
XCKU9P-2FFVE900E
XCKU9P-2FFVE900I
XCKU9P-L1FFVE900E
XCKU9P-L1FFVE900I
XCKU9P-L2FFVE900E
XCKU9P-L2FFVE900I
XC7V2000T-1FHG1761C
XC7V2000T-1FHG1761I
XC7V2000T-1FLG1925C
XC7V2000T-1FLG1925I
XC7V2000T-2FHG1761C
XC7V2000T-2FHG1761E
XC7V2000T-2FHG1761I
XC7V2000T-2FLG1925C
XC7V2000T-2FLG1925I
XC7V2000T-3FHG1761C
XC7V585T-1FFG1157I
XC7V585T-1FFG1761C
XC7V585T-1FFG1761I
XC7V585T-1FFG1761I
XC7V585T-2FFG1761C
XC7V585T-2FFG1761E
XC7V585T-2FFG1761I
XC7V585T-3FFG1761C
