Xilinx 7 series FPGAs comprise three new FPGA families that address the complete range of system requirements, ranging from low cost, small form factor, cost-sensitive, high-volume applications to ultra high-end connectivity bandwidth, logic capacity, and signal processing capability for the most demanding high-performance applications. Kintex-7 Family: Optimized for best price-performance with a 2X improvement compared to previous generation, enabling a new class of FPGAs.
Built on a state-of-the-art, high-performance, low-power (HPL), 28 nm, high-k metal gate (HKMG) process technology, 7 series FPGAs enable an unparalleled increase in system performance with 2.9 Tb/s of I/O bandwidth, 2 million logic cell capacity, and 5.3 TMAC/s DSP, while consuming 50% less power than previous generation devices to offer a fully programmable alternative to ASSPs and ASICs.
Key Features
Advanced high-performance FPGA logic based on real 6-input lookup table (LUT) technology configurable as distributed memory.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
High-performance SelectIO technology with support for DDR3 interfaces up to 1,866 Mb/s.
High-speed serial connectivity with built-in multi-gigabit transceivers from 600 Mb/s to maximum rates of 6.6 Gb/s up to 28.05 Gb/s, offering a special low-power mode, optimized for chip-to-chip interfaces.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
DSP slices with 25 x 18 multiplier, 48-bit accumulator, and pre-adder for high-performance filtering, including optimized symmetric coefficient filtering.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Integrated block for PCI Express® (PCIe), for up to x8 Gen3 Endpoint and Root Port designs.
Wide variety of configuration options, including support for commodity memories, 256-bit AES encryption with HMAC/SHA-256 authentication, and built-in SEU detection and correction.
Low-cost, wire-bond, lidless flip-chip, and high signal integrity flipchip packaging offering easy migration between family members in the same package. All packages available in Pb-free and selected packages in Pb option.
Designed for high performance and lowest power with 28 nm, HKMG, HPL process, 1.0V core voltage process technology and 0.9V core voltage option for even lower power.
公司主要經(jīng)營(yíng)以下產(chǎn)品：
1、XILINX公司的系統(tǒng)級(jí)可編程FPGA器件；在線復(fù)雜可編程邏輯CPLD器件；配置存儲(chǔ)器PROM等。
2、ALTERA公司的現(xiàn)場(chǎng)可編程FPGA全系列；可編程邏輯器件CPLD系列；配置存儲(chǔ)器PROM。
3、FREESCALE公司汽車IC系列：車載8-Bit、16-Bit、32-BitMCU微控制器，MPU微處理器，ARM微處理器。
4、TI公司的數(shù)字信號(hào)處理器DSP及外圍器件；運(yùn)算放大器；模擬器件；A/D、D/A數(shù)字模擬轉(zhuǎn)換器件；邏輯器件；PCI橋；430系列微處理器。ADI公司的數(shù)字信號(hào)處理器DSP。
5、ADI公司穩(wěn)壓器；電源IC；數(shù)字式信號(hào)處理器；微控制器；接口-模擬開關(guān)；驅(qū)動(dòng)器；數(shù)據(jù)采集；電壓基準(zhǔn)；監(jiān)控器等產(chǎn)品。
6、MAXIM公司模擬開關(guān)；數(shù)模轉(zhuǎn)換器；驅(qū)動(dòng)器；數(shù)據(jù)采集；比較器；電池管理；PMIC監(jiān)控器；穩(wěn)壓器；電源IC微控制器等產(chǎn)品。
7、ISSI、IDT、CYPRESS、HITACHI、NEC、TOSHIBA、SAMSUNG、HUNIX、SGS-THOMSON等公司高速靜態(tài)存儲(chǔ)器SRAM、低功耗大容量SRAM；FIFO；雙口RAM；FLASH；SDRAM、EDO；EPROM；EEPROM等各類存儲(chǔ)器。
8、各類高性能八位、十六位、三十二位單片機(jī)；在系統(tǒng)可編程ISP、在系統(tǒng)可編程IAP微處理器；ARM內(nèi)核嵌入式系統(tǒng)；USB接口、CAN總線、LCD顯示驅(qū)動(dòng)等外圍IC。主要品牌有：TI、ADI、PHILIPS、WINBONG、ATMEL、INTEL、HITACHI、MOTOROLA、NEC MICROCHIP、SGS-THOMSON、CYPRESS、。
9、公司設(shè)立國(guó)外采購(gòu)部為客戶面向全世界進(jìn)行采購(gòu)，專門為客戶找尋物美價(jià)廉的、偏冷門的、軍工級(jí)、停產(chǎn)的IC。直接向國(guó)外的廠商訂購(gòu)貨物，省去不少的中間貿(mào)易環(huán)節(jié)。為實(shí)現(xiàn)品質(zhì)保證、強(qiáng)有力的競(jìng)爭(zhēng)價(jià)格、快捷交貨、完善的服務(wù)提供了保證。
公司一貫堅(jiān)持“誠(chéng)信經(jīng)營(yíng)，信譽(yù)第一，貨真價(jià)實(shí)，互利共贏”的經(jīng)營(yíng)方針。這也是我們公司贏得老客戶并與之長(zhǎng)期合作的宗旨。
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SAMSUNG/三星
INA139NA/250
TI
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FAIRCHILD/仙童
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IR
SN74AHC1G125DBVR
TI
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TI
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ADI/亞德諾
K4T1G164QE-HCF8
SAMSUNG/三星
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SAMSUNG/三星
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SAMSUNG/三星
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SAMSUNG/三星
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TI
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TI
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TI
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TI
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TI
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SAMSUNG/三星
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TI
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FAIRCHILD/仙童
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IR
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TI
REF3026AIDBZR
TI
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ADI/亞德諾
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SAMSUNG/三星
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TI
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TI
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TI
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TI
SN54LS06J
TI
SN54LS175J
TI
SN54LS00J
TI
SN54LS03J
TI
