TGP12000ULM-0.100-00-0808
發(fā)布時(shí)間:2021/7/5 10:34:00 訪問次數(shù):102 發(fā)布企業(yè):深圳市科雨電子有限公司
熱介面產(chǎn)品 GAP PAD, Thermal Interface Material, High Performance, 12 W/m-K Thermal Conductivity, Ultra Low Modulus, 8 Inch x 8 Inch Sheet, 0.100 Inch Thickness, GAP PAD TGP 12000ULM Series, IDH 2678613
上一篇：SCN-2-65+
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