不含鉛生命周期Contact ManufacturerObjectid115052089包裝說(shuō)明FBGA, BGA12,3X4,16制造商包裝代碼567QXReach Compliance Codeunknown風(fēng)險(xiǎn)等級(jí)5.77驅(qū)動(dòng)器位數(shù)1JESD-30 代碼R-PBGA-B12端子數(shù)量12最高工作溫度105 °C最低工作溫度-40 °C封裝主體材料PLASTIC/EPOXY封裝代碼FBGA封裝等效代碼BGA12,3X4,16封裝形狀RECTANGULAR封裝形式GRID ARRAY, FINE PITCH電源2.5/20 V認(rèn)證狀態(tài)Not Qualified子類別Peripheral Drivers表面貼裝YES溫度等級(jí)INDUSTRIAL端子形式BALL端子節(jié)距0.4 mm端子位置BOTTOM FPF2280BUCX-F130
發(fā)布時(shí)間:2022/6/21 15:24:00 訪問(wèn)次數(shù):64
參數(shù)名稱參數(shù)值Source Content uidFPF2280BUCX-F130Brand NameON Semiconductor是否無(wú)鉛不含鉛生命周期Contact ManufacturerObjectid115052089包裝說(shuō)明FBGA, BGA12,3X4,16制造商包裝代碼567QXReach Compliance Codeunknown風(fēng)險(xiǎn)等級(jí)5.77驅(qū)動(dòng)器位數(shù)1JESD-30 代碼R-PBGA-B12端子數(shù)量12最高工作溫度105 °C最低工作溫度-40 °C封裝主體材料PLASTIC/EPOXY封裝代碼FBGA封裝等效代碼BGA12,3X4,16封裝形狀RECTANGULAR封裝形式GRID ARRAY, FINE PITCH電源2.5/20 V認(rèn)證狀態(tài)Not Qualified子類別Peripheral Drivers表面貼裝YES溫度等級(jí)INDUSTRIAL端子形式BALL端子節(jié)距0.4 mm端子位置BOTTOM
不含鉛生命周期Contact ManufacturerObjectid115052089包裝說(shuō)明FBGA, BGA12,3X4,16制造商包裝代碼567QXReach Compliance Codeunknown風(fēng)險(xiǎn)等級(jí)5.77驅(qū)動(dòng)器位數(shù)1JESD-30 代碼R-PBGA-B12端子數(shù)量12最高工作溫度105 °C最低工作溫度-40 °C封裝主體材料PLASTIC/EPOXY封裝代碼FBGA封裝等效代碼BGA12,3X4,16封裝形狀RECTANGULAR封裝形式GRID ARRAY, FINE PITCH電源2.5/20 V認(rèn)證狀態(tài)Not Qualified子類別Peripheral Drivers表面貼裝YES溫度等級(jí)INDUSTRIAL端子形式BALL端子節(jié)距0.4 mm端子位置BOTTOM 
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