列出影響制造成本的主要因素
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1.列出影響制造成本的主要因素。NCP1450ASN50T1G
2.描述擁有成本( C00)模型的意圖和因素。
3.列出統(tǒng)計制程控制的優(yōu)點。
4.識別控制圖的構(gòu)成和用途。
5.列出并討論自動化的不同水平。
6.列出用來評估某種特定設(shè)備的因素。
7.定義術(shù)語CIM和CAM.以及它們在生產(chǎn)設(shè)置中的作用。
[ 1 ] Semi/Semetech,Sem/ Reports ,2012 ,www. semi. org, May 2013.
[ 2] Clark,P.," GlobaIFoundries Hints at $10 Billion Fab Location," EE Times,Jan. 11 ,2013.
[ 3 ] Harper,J. G. and Bailey,L. G., " Flexible Material Handling Automation in Wafer Fabrication, " SoLid State
Techn.ology,Jul. 1984 :94.
[4] Lam,D.,"Minifabs Lower Bamers t0 300 mm," Solid State Techn.ology,Jan.1999:72.
[ 5 ] Sonderman ,T. ,Reaping the Benejtts of the 450-mm Transition. , Semicon West , San F'rancisco , CA : 201 1 .
[ 6 ] Arden , W., Brillouet , M., Cogez , P., et al.,More Than. Moore White Paper ,ITRS White Paper, Nov. 8 ,2011.
[7] Foster,L. and Pollal,D.,300-m,m Wafer Fab Logistics an,d Automated MateriaL Han,dlin,g Systems,llan,dbook
of Semiconductor Manujacturin,g Techn.ology,2007,CRC Press,New York,NY:33-17.
[8] Burggraaf, P., " Applying Cost Modeling to Stepper Lithography," Semicon,ductor In.tern,ation,aL, Cahners
Publishing, Feb. 1994 :40.
[ 9 ] Shinoda , S., " Total Automation in Wafer Fabrication , " Semicon,ductor In,tern,ation,aL , Sep. 1986 :87.
[ 10 ] Singer,P.," The Thinking behind Today' s Cluster Tools, " Semiconductor Intern,ation.al, Aug. 1993 :46.
[11] Foster,L. and Pollal,D.,300-mm Wafer Fab Logistics an,d Automated Material Han,dlin,g Systems,llandbook
oj' Semicon,ductor Manufacturin,g Techn,ology,2007 , CRC Press , New York , NY : 33 -17.
[ 12 ] Moslehi,M., " Single-Wafer Processing Tools for Agile Semiconductor Production, "So//d State. Techn,ology,
PennWell Publications,Jan. 1994 :35.
[13] Sonderman,T.,Reapin,g the Ben,ejits of the 450-mm Transition,Semicon West,CA :2011.
[ 14] Kerby,R. and Novak,L.,"ESH: A Green Fab begins with You," Solid State Techn,ology,Jan. 1998 :82.
[ 15] Campbell, D. M. and Ardehale, Z., " Process Control for Semiconductor Manufacturing," Semicon.du,ctor
Intern,ationaI,Jun. 1984 : 127.
[ 16 ] Levinson,W., " Statistical Process Control in Microelectronics Manufacturing," Semiconductor In.tern.atiotzal,
Cahners Publishing,Nov. 1994 :95.
[ 17 ] Levy,K., " Productivity and Process Feedback, " Solid State Technology,Jul. 1984:177.
[18] Ibid.
[ 19 ] Hnatek,E., "IS0 9000 in the Semiconductor Industry, " Semicon,du.ctor In,tern,ation,aI,Jul. 1993 :88.
[ 20] Dunn,P.,"The Unexpected Benefits of IS0 9000," Solid State Techn,ology,Mar. 1994:55.
1.列出影響制造成本的主要因素。NCP1450ASN50T1G
2.描述擁有成本( C00)模型的意圖和因素。
3.列出統(tǒng)計制程控制的優(yōu)點。
4.識別控制圖的構(gòu)成和用途。
5.列出并討論自動化的不同水平。
6.列出用來評估某種特定設(shè)備的因素。
7.定義術(shù)語CIM和CAM.以及它們在生產(chǎn)設(shè)置中的作用。
[ 1 ] Semi/Semetech,Sem/ Reports ,2012 ,www. semi. org, May 2013.
[ 2] Clark,P.," GlobaIFoundries Hints at $10 Billion Fab Location," EE Times,Jan. 11 ,2013.
[ 3 ] Harper,J. G. and Bailey,L. G., " Flexible Material Handling Automation in Wafer Fabrication, " SoLid State
Techn.ology,Jul. 1984 :94.
[4] Lam,D.,"Minifabs Lower Bamers t0 300 mm," Solid State Techn.ology,Jan.1999:72.
[ 5 ] Sonderman ,T. ,Reaping the Benejtts of the 450-mm Transition. , Semicon West , San F'rancisco , CA : 201 1 .
[ 6 ] Arden , W., Brillouet , M., Cogez , P., et al.,More Than. Moore White Paper ,ITRS White Paper, Nov. 8 ,2011.
[7] Foster,L. and Pollal,D.,300-m,m Wafer Fab Logistics an,d Automated MateriaL Han,dlin,g Systems,llan,dbook
of Semiconductor Manujacturin,g Techn.ology,2007,CRC Press,New York,NY:33-17.
[8] Burggraaf, P., " Applying Cost Modeling to Stepper Lithography," Semicon,ductor In.tern,ation,aL, Cahners
Publishing, Feb. 1994 :40.
[ 9 ] Shinoda , S., " Total Automation in Wafer Fabrication , " Semicon,ductor In,tern,ation,aL , Sep. 1986 :87.
[ 10 ] Singer,P.," The Thinking behind Today' s Cluster Tools, " Semiconductor Intern,ation.al, Aug. 1993 :46.
[11] Foster,L. and Pollal,D.,300-mm Wafer Fab Logistics an,d Automated Material Han,dlin,g Systems,llandbook
oj' Semicon,ductor Manufacturin,g Techn,ology,2007 , CRC Press , New York , NY : 33 -17.
[ 12 ] Moslehi,M., " Single-Wafer Processing Tools for Agile Semiconductor Production, "So//d State. Techn,ology,
PennWell Publications,Jan. 1994 :35.
[13] Sonderman,T.,Reapin,g the Ben,ejits of the 450-mm Transition,Semicon West,CA :2011.
[ 14] Kerby,R. and Novak,L.,"ESH: A Green Fab begins with You," Solid State Techn,ology,Jan. 1998 :82.
[ 15] Campbell, D. M. and Ardehale, Z., " Process Control for Semiconductor Manufacturing," Semicon.du,ctor
Intern,ationaI,Jun. 1984 : 127.
[ 16 ] Levinson,W., " Statistical Process Control in Microelectronics Manufacturing," Semiconductor In.tern.atiotzal,
Cahners Publishing,Nov. 1994 :95.
[ 17 ] Levy,K., " Productivity and Process Feedback, " Solid State Technology,Jul. 1984:177.
[18] Ibid.
[ 19 ] Hnatek,E., "IS0 9000 in the Semiconductor Industry, " Semicon,du.ctor In,tern,ation,aI,Jul. 1993 :88.
[ 20] Dunn,P.,"The Unexpected Benefits of IS0 9000," Solid State Techn,ology,Mar. 1994:55.
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